Asrock X870 Pro RS WiFi AMD X870 Socket AM5 ATX

AMD Socket AM5 AMD Ryzen 7000 Series, AMD Ryzen 8000 Series, AMD Ryzen 9000 Series. PC ATX AMD X870 Realtek ALC1220 7.1 channels. DDR5-SDRAM 4 DIMM Maximum internal memory: 256 GB. HDD & SSD M.2, SATA III RAID support Number of storage drives supported: 7. CrossFire. BIOS type: UEFI AMI 256 Mbit. 2.5 Gigabit Ethernet Wi-Fi Wi-Fi 7 (802.11be) Bluetooth 5.4. Modern and futuristic, with the attractive specifications and perfect balance, the Race Sport (RS) Edition is the evolution of the most popular PRO series motherboard.. Durable Cap with 1000uF Capacitance. The durable capacitors with 1000uF capacitance offers several benefits:. Higher Capacitance: Greater charge storage for better support under high loads.. Lower Ripple: Reduced power output fluctuations, improving quality.. More Stable Output Current: Stable power supply, minimizing voltage impacts.. Better Performance & System Stability: Increased reliability and consistent performance.. 14+2+1 Power Phase Design. Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.. Dr. MOS. Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.. Hi-Density Power Connector. CPU overclocking requires higher current, ASRock Hi-Density Power connectors is able to withstand current higher traditional CPU 8-pin and ATX 24-pin connector, giving a more stable system as well as lowering the risk of fire under heavy overclocking.. 8 Layer PCB design. The 8 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency, ensures a reliable and long-lasting system while delivering ultimate performance without any compromise.. DDR5 XMP & EXPO Support. Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboards is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.. * There are certain risks involved with memory overclocking and may affect your system’s stability. Please realize that overclocking should be done at your own risk and expense. EXPO/XMP profile support may vary by different system configuration, memory modules and motherboard models. Please refer to Memory QVL for the completed support list.. High Speed M.2 Solution. PCIe Gen5 Blazing M.2. The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128GB/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.. DIY Friendly Design. Besides the M.2 SSD toolless design on the motherboard, ASRock up a notch by introducing this industry first M.2 heatsink quick release mechanism on the motherboard. The user friendly toolless design helps installing M.2 SSD super easy & simple.. The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.. Enlarged M.2 Heatsink. The extra large aluminum alloy M.2 heatsink effectively improves heat dissipation to keep those high speed M.2 SSDs as cool as possible, it is able to give better stability while maintaining top performance.. Tired of dropping screws or screws missing inside chassis?. The enhanced M.2 heatsink with anti-drop screw design that make sure installation process more easily.. Cooling. Intelligent Cooling Design. Aluminum Heatsink. The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.. Connectivity. Wi-Fi 7 offers higher data throughput, lower latency, and Multi-link Operation. These features ensure a smooth and real-time interactive experience, making the VR/AR experience more immersive and connected.. Latest WiFi 7 technology delivers extreme wireless internet speeds and low latency, with higher throughput and Multi-RU as well as puncturing technology. The new WiFi 7(802.11be) technology is able to accelerate cloud-based gaming, 8K video streaming, and video conferencing.. Multi-link Operation (MLO) enables the simultaneous use of multiple bands and channels, boosting speed and throughput while reducing latency for a smoother, faste